• Job Description

  Req#: JR0263545

  Job Details:

  Job Description:

  Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. So join us and help us create the next generation of technologies that will shape the future for decades to come.

  As a Materials Analysis Engineer, you will be part of Technology Development Labs responsible for identifying and developing materials characterization and failure analysis techniques in support of Intel's next generation silicon process development and foundry service. The candidate must work in concert with Process Development and Quality/Reliability Engineers to enable robust failure rate models and risk assessments of the silicon processes under development to improve process performance, product yield, quality and/or reliability. The scope may include material analysis at wafer level and unit level for frontend, backend, far backend process as well as chip package integration.

  Responsibilities will include but are not limited to:

  • Implementing thermo-mechanical lab characterization techniques to determine fundamental structure/properties of thin film materials, and to collaborate with process development engineers to apply the learning to improve process performance, yield and reliability.

  • Analyzing thermal mechanical test data, failure modes; reporting the lab results with recommendation of corrective actions to prevent reoccurrence of the problems.

  • Supporting new process development, product introduction to Fab and technology startup in volume production factory. Apply automation, AI/ML solutions to improve analysis process.

  • Developing thermo-mechanical lab capabilities to meet needs of the advanced Si process technology and turnkey foundry service to internal and external customer's products. May necessitate the development of improved/new lab tools and methodologies.

  • Collaborating with device and process engineers to determine the relationship of materials properties to mechanical, electrical performance and quality/reliability engineers to assist in risk assessment.

  Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.

  See https://www.intel.com/content/www/us/en/jobs/benefits.html for more details.

  Qualifications:

  Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
  
  Minimum Qualifications:

  • Ph.D. in Mechanical Engineering, Physics, Materials Science or related Engineering field of study.

  1+ year(s) of experience in at least one of the following:

  • Thin film mechanical property measurement using 4-point bend, nano indenter, pico-indenter, and dynamic mechanical analyzer etc.

  • Nanoscale/microscale thermal transport measurement.

  • Material analysis using TEM, SEM, Focused Ion Beam (FIB), EBSD, AFM, X-ray diffraction (XRD)/X-Ray Reflectance (XRR).

  
  Preferred Qualifications:

  • Knowledge of semiconductor fabrication, test and/or assembly packaging processing and associated materials.

  • Deposition and characterization of semiconductor materials.

  • Device physics.

  • Interconnect reliability.

  Job Type:

  College Grad

  Shift:

  Shift 1 (United States of America)

  Primary Location:

  US, Oregon, Hillsboro

  Additional Locations:

  Business group:

  As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

  Posting Statement:

  All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

  Position of Trust

  N/A

  Work Model for this Role

  This role will require an on-site presence.

• About the company

  Intel's innovation in cloud computing, data center, Internet of Things, and PC solutions is powering the smart and connected digital world we live in.

Notice