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Advanced Packaging Finite Element Analysis Engineer

THE ROLE:

This position is on the Advanced Technology Packaging team at AMD in Austin, Texas. Help AMD design next generation high performance IC products with advanced thermal mechanical solutions to address next generation high performance compute challenges.

THE PERSON:

The candidate should have strong Finite Elemental Analysis (FEA) fundamentals. Experience creating models using ANSYS, LS-DYNA, ABAQUS or similar tools. Excellent communication skills in English and ability to work with global team. Strong attention to detail and problem-solving skills.

KEY RESPONSIBILITIES:

• Develop FEA models for various wafer-level and assembly processes.
• Perform system level FEA simulations for drop/vibration/etc.
• Perform Multiphysics simulations, eg., Thermal-Structural, Electro-Thermal and Fluid-Solid Interaction models.
• Summarize analysis and communicate through presentations to AMD, suppliers, and customers.
• Modeling automation using scripting languages like Python, Matlab, etc.

PREFERRED EXPERIENCE:

• Familiarity with Advanced Packaging Techniques, fanout, 3D stacking, 2.5D, MCM packaging, silicon photonics.

ACADEMIC CREDENTIALS:

MS/PhD in Mechanical , Material Science, or related engineering field.

LOCATION:

Austin, Texas

Requisition Number: 186424
Country: United States State: Texas City: Austin
Job Function: Packaging Engineering

Benefits offered are described here.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.