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Job Description
- Req#: R-10052872
- Package Simulation;
- Fundamentals of CMOS & MEMS;
- Materials Science;
- Design Engineering Experiments;
- Lab microscopy, including SEM and optical; and
- Lab level process such as photo or etch.
Responsible for reviewing the packaging of products in accordance with plan laid out by process engineer and sales and makes recommendations or improvements as required; working with RF packaging team in new packaging materials introduction for high power RF devices (product types include high power RF plastics, ceramic discrete, and air cavity packages); bringing package innovation to the RF power packaging portfolio and contribute to the packaging roadmap for RF Power Division; supporting the development team to work on package solution for RF power GaN products enabling best possible thermal management utilizing high thermally conductive substrates & innovative high conductive die attach materials; performing simulation for new device packaging and validate on actual products; conducting product analysis and evaluation using Optical inspection or Ultrasonic imaging (use of failure analysis tools such as cross-sectioning, SEM etc. required on occasional basis.); working in cross-functional teams including NPI and Manufacturing to evaluate package changes and compare the influence of various package design choices on product performance; creating, conducting, and analyzing Design of Experiments (DOE) for development and problem solving; and documenting all work in formal report, presentations and/or application notes. Requires international and domestic travel, 5% of the time.
Qualifications:
Master’s degree in Mechanical Engineering, Manufacturing Engineering, Materials Science and Engineering, Industrial Engineering, foreign equivalent or closely related field.
Required skills:
Position requires completion of a graduate-level course, research project, internship or thesis involving:
More information about NXP in the United States...
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.
About the company
NXP Semiconductors NV is an American Dutch semiconductor manufacturer with headquarters in Eindhoven, Netherlands And Austin .
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