NXP Semiconductors
Process Engineer
PayCompetitive
LocationKuala Lumpur/Wilayah Persekutuan Kuala Lumpur
Employment typeFull-Time
This job is now closed
Job Description
- Req#: R-10053184
1. TBE Process Engineer for Flip Chip Devices.2. Lead all the FC Quality issues and related customer feedback.3. Drive Overall FC Yield as part of ATKL TBE CWATY.4. Lead all the FC vision firewall implementation to close VM gap.5. Lead FC manual inspection removal as part of overall automation strategy.6. LOH, Line sustaining for FC product to meet manuf indices.7. Lead NPI IMX.95, IMX.943.. and others BGA and overall FC related NPI.8. Smart Store design & development●Requirement:
1. Educational background : Engineering Degree (Electronics or Mechanical or Mechatronics or Chemical)2. Preferred working experience in semiconductor manufacturing and vision inspection.3. Speedy, Multi-tasking, results-orientated and able to work in fast phase manufacturing environment.4. Open- minded, willing to accept new challenges and overcome it with positive attitude.5. M otivated team player with high level of ownership.6. Able to communicate with all levels of people.7. Knowledge/experience in programming language a plus.About the company
NXP Semiconductors NV is an American Dutch semiconductor manufacturer with headquarters in Eindhoven, Netherlands And Austin .