NXP Semiconductors
Process Engineer WB AOI
This job is now closed
Job Description
- Req#: R-10052209
Responsible on wire bond AOI Process at Front-end assembly.
To maintain the wire bond AOI performance through various leading indicators (WB AOI yield, MDR, Assist)
Work with the equipment & manufacturing team on continue improvement programs to meet department and factory indices.
To support manufacturing to meet the output and cycle time.
Work with NTI/NPI teams to qualify new recipes in WB AOI
Work with cross functional team to resolve quality issues.
Conducting experiments methodically, analyzing data and interpreting results
Engineers will be part of a team in developing systems, fixing problems or creating solutions.
Must be able to communicate your plans, thoughts, and rationale in your job. Good communication skills will help you greatly in accomplishing your job
Develop best practices, routines and innovative solutions to improve production rates and quality of output
Perform process simulations and risk assessments
Manage cost and time constraints
Responsibility to ensure zero safety and ethic issue at workplace.
Responsibility for 5S activities at WB AOI area.
Responsible for FMEA, control plan, OCAP and SWEJob requirement:
• Candidate must possess at least a Bachelor's Degree in Engineering (Electrical/Electronic/Mechanical) or equivalent.• More than 2-3 years of working experience.• Strong technical knowledge related to semiconductor and AOI• Knowledge on SPC, Process Control and other relevant statistical & problem-solving skills.• Analytical thinker• Good communication, interpersonal skills with strong leadership ability.• Good Project Management skill and good team player.• Other technical requirements include Microsoft office, Technical writing skills and good presentation skillAbout the company
NXP Semiconductors NV is an American Dutch semiconductor manufacturer with headquarters in Eindhoven, Netherlands And Austin .
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