• Job Description

  Req#: JR0253321

  Job Details:

  Job Description:

  Semiconductor Research Engineer Undergraduate Intern: The Assembly and Test Technology Development (ATTD) Experimental Mechanics Lab deals with thermo-mechanical challenges in the development of advanced packaging technologies.

  The personnel in this Research and Development lab use a variety of tools to study the behavior of electronic packages and their material constituents under different mechanical/thermal loading conditions: like dynamic warpage of packages using optics-based tools; interfacial adhesion strength using Double Cantilever Beam test; fracture toughness of bulk materials using three-point bend test; material CTE using Digital Image Correlation method; and defect (or crack) detection and classification using optical (or acoustic emission) sensors and AI/ML codes. Interns typically help develop new metrologies or software capabilities for use with next-gen packaging technologies.

  Responsibilities may be quite diverse of a nonexempt technical nature. U.S. experience and education requirements will vary significantly depending on the unique needs of the job. Job assignments are usually for the summer or for short periods during breaks from school.

  The candidate should also exhibit the following behavioral traits/skills:

  • Experimental Mechanics background
  • problem solving
  • programming skills

  Qualifications:

  You must possess the below requirements to be initially considered for this position.

  Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

  Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

  Minimum Qualifications

  • Must be pursuing a bachelor's degree with 3+ months experience in one of the following majors: Mechanical Engineering or Materials Science Engineering or related field.

  Preferred Qualifications

  3+ months experience (pursuing bachelor's) with one or more of the following:

  material characterization, load frames, DAQs, PID controllers, basic optics, lasers, silicon photonics, 3D CAD, structural health monitoring

  MATLAB, Python, LabView programming

  Job Type:

  Student / Intern

  Shift:

  Shift 1 (United States of America)

  Primary Location:

  US, Arizona, Phoenix

  Additional Locations:

  Business group:

  As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

  Posting Statement:

  All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

  Position of Trust

  N/A

  Work Model for this Role

  This role will require an on-site presence.

• About the company

  Intel's innovation in cloud computing, data center, Internet of Things, and PC solutions is powering the smart and connected digital world we live in.

Notice