• Job Description

  Req#: 21163

  In an increasingly connected world, the pandemic has highlighted just how essential telecom networks are to keeping society running. The Network Infrastructure group is at the heart of a revolution to connectivity, pushing the boundaries to deliver more and faster network capacity to people worldwide through our ambition, innovation, and technical expertise

  Join Optical Networks division, where innovation meets scale in the AI-driven data center era. With the recent acquisition of Infinera, we’ve united two industry leaders to create an optical networking powerhouse—combining cutting-edge technology with proven leadership to redefine the future of connectivity.

  Infinera is now part of the Nokia Corporation and its subsidiaries. When you apply, the information you share will be handled with care and used only for recruitment purposes within the group.

  Qualifications

  • Understanding of semiconductor processes and device physics
  • Semiconductor FAB / cleanroom environment experience
  • Understanding of statistical process control methods
  • Familiarity with or direct experience in most of the standard III-V process technologies required for wafer fabrication such as epitaxy, wet etching, plasma etching, metal deposition, and photolithography
  • Ability to work in a CAD design environment, generate and maintain mask files as well as die level test structure files
  • Database interrogation, statistical analysis skills, and design of experiments
  • Excellent communications skills and ability to present data, ideas, and recommendations to a diverse audience

  Education Required:

  B.S. with at least 3 years of work experience. M.S. level or higher in Electrical Engineering, Photonics, Physics, or Materials Science is preferred.

  Responsibilities

  • Manage quality and yield of PIC wafers based on knowledge of fab processes, device physics, and the analysis of test and reliability data
  • Troubleshoot and resolve process deviations and test failures through a detailed analysis of test data and process history
  • Establish and maintain inline FAB process specifications.
  • Continuous surveillance of inline FAB process capability (CPK)
  • Investigate the impact of design rules on process yields, develop test structures for effective process control
  • Initiate and carry out yield improvement activities, from inception through qualification and implementation
  • Support next-generation PIC platform development and participate in technology development, transfer, and ramp activities to meet yield, reliability, cost, and device performance goals
  • Support Process Engineering to improve process stability and capability
  • Support Operations to improve throughput and cycle time

• About the company

  Nokia’s transition to a primary focus on telecommunications began in the 1990s. The first GSM call was made in 1991 using Nokia equipment. Rapid success in the mobile phone sector allowed Nokia to become by 1998, the best-selling mobile phone brand in the world. In 2003 Nokia introduced the first camera phone. In 2011, to address increasing competition from iOS and Android operating systems, Nokia entered into a strategic partnership with Microsoft. In 2014 Nokia sold its mobile and devices division to Microsoft. The creation of Nokia Networks, following the buy-out of joint-venture partner Siemens in 2013, laid the foundation for Nokia’s transformation into primarily a network hardware and software provider. The 2015 acquisition of Franco-American telecommunications equipment provider Alcatel-Lucent greatly broadened the scope of Nokia’s portfolio and customer base. Additional acquisitions have positioned Nokia to be an industry leader in the transition to 5G wireless technology by offering the only end-to-end 5G network portfolio available on a global basis. In 2016 the Nokia brand re-entered the mobile handset market through a licensing agreement with HMD Global, allowing them to offer phones under the Nokia brand.

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