This job is now closed
Job Description
- Req#: JR0243346
- You will be providing predictive structural analysis and solutions for the state-of-the-art systems within the Intel Data Center Platform Group.
- You will be part of a multi-disciplinary global team to contribute to the development of cooling solutions, retention mechanisms, and implementation of new technologies.
- Structural Analysts within DPG are responsible for developing predictive analysis using both static and dynamic FEA analysis.
- Duties will include structural feasibility analysis, creating detailed component level and system level FEA models in Abaqus CAE, Scripting to support Abaqus CAE analysis automation, providing recommendations and solutions based on analysis results, Structural Validation, test plan creation and execution in the Mechanical-Dynamics Lab, ensuring structural requirements fulfillment from Mechanical, Thermal, and Hardware teams.
- You will be interacting with suppliers and customers worldwide.
- Highly adaptable to change.
- Advanced English and Spanish communication skills.
- Bachelor's degree in Mechanical Engineering, Material Science or equivalent field.
- 2+ years performing static and dynamic structural FEA analysis using Abaqus CAE or equivalent FEA tool.
- Working knowledge of mechanical design.
- Strong communication skills in English and Spanish.
- Knowledge of FEA process modeling.
- Masters or PhD degree in Mechanical Engineering, Material Science, or equivalent discipline.
- HVM manufacturing processes plastic injection molding, sheet metal, machining, die casting, cold forming, etc.
- Knowledge of heat transfer, heatsink design, server architecture and layouts.
- Experience with static and dynamic structural testing procedures, instrumentation accelerometers, strain gauges, load cells etc.
- Fixture development, data acquisition, and DOE development.
- Experience with structural FMEA.
- Scripting experience for automation in ABQ CAE.
- Demonstrated experience with hands on tools i.e. hand tools, Instron or MTS, force testers such as Imada, Shadow Moire, Digital Image Correlation
- Creep and load degradation analysis.
Job Details:
Job Description:
The semiconductor industry follows a steady and incessant trend of volume reduction and compact component placement, resulting in unprecedent thermo-mechanical challenges to dissipate the increased power associated to higher performance. As members of our Platform Hardware Engineering Division, mechanical, structural, thermal and system engineers work in close collaboration with multiple disciplines in different geos to develop novel thermo-mechanical solutions for the next generation of high-end microprocessors and systems.
We are looking for a passionate, self-driven, proactive and highly change tolerant individual that is looking for new challenges and is willing to work with a highly interactive and motivated team.
As a Structural Mechanical Engineer within the Thermal Mechanical Solutions engineering team,
Behavioral traits:
Qualifications:
Minimum Qualifications:
You must possess the below minimum qualifications to be initially considered for this position,
Preferred Qualifications:
Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Experience listed below would be obtained through a combination of your schoolwork/classes/research and/or relevant previous job and/or internship experiences.
Job Type:
Experienced HireShift:
Shift 1 (Mexico)Primary Location:
Mexico, GuadalajaraAdditional Locations:
Business group:
The Data Platforms Engineering and Architecture (DPEA) Group invents, designs & builds the world's most critical computing platforms which fuel Intel's most important business and solve the world's most fundamental problems. DPEA enables that data center which is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/AWork Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.About the company
Intel's innovation in cloud computing, data center, Internet of Things, and PC solutions is powering the smart and connected digital world we live in.
Notice
Talentify is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or protected veteran status.
Talentify provides reasonable accommodations to qualified applicants with disabilities, including disabled veterans. Request assistance at accessibility@talentify.io or 407-000-0000.
Federal law requires every new hire to complete Form I-9 and present proof of identity and U.S. work eligibility.
An Automated Employment Decision Tool (AEDT) will score your job-related skills and responses. Bias-audit & data-use details: www.talentify.io/bias-audit-report. NYC applicants may request an alternative process or accommodation at aedt@talentify.io or 407-000-0000.