NXP Semiconductors
Wire Bond Process Engineer
PayCompetitive
LocationKuala Lumpur/Wilayah Persekutuan Kuala Lumpur
Employment typeFull-Time
This job is now closed
Job Description
- Req#: R-10051592
Job description:
• Responsible for supporting process development of Copper Wire Bond process in automotive BGA & QFP applications.• Responsible for quality , yield improvement & platform transfer qualification.• Responsible for customer complaint on rootcause analysis and corrective action.• Responsible for scrap reduction efforts through problem solving and process optimization.• Responsible for process documentation, process spec, standard work instruction, OCAP etc.• Take ownership to work with cross functional team to resolve quality issues.Job requirement:
• Candidate must possess at least a Bachelor's Degree in Engineering (Material Science), Engineering (Electrical/Electronic) or equivalent.• Min 2 years experience in Wire bond/AOI in semiconductor assembly background and knowledge preferably.• Good knowledge in material science especially metallurgy• Good communication, interpersonal skills with strong leadership ability• Good Project Management skill and good team playerAbout the company
NXP Semiconductors NV is an American Dutch semiconductor manufacturer with headquarters in Eindhoven, Netherlands And Austin .