• Job Description

  Req#: JR0262620

  Job Details:

  Job Description:

  As a quality and reliability engineer, you'll join a team developing leading edge semiconductor package technologies for Intel's latest products. Package reliability engineers take responsibility for setting reliability requirements to meet customer needs. We influence the design, material selection and process development of the new package technology to meet those needs. We use a wide variety of skills, from analytical models to advanced experimental designs to extensive data analysis, to evaluate and improve the package technology. Together with our technology development partners, we find the root cause of failure mechanisms and devise solutions. Quality and reliability engineers are analytical problem solvers in a high-paced, technically challenging environment. We measure our success by delivering world-class quality on cutting edge package technologies, faster and at a competitive cost.

  This job might be for you, if:

  • You have an interest on semiconductor package interconnects, metallic compounds, metal diffusion and electro-migration.
  • You like to find problems before they find you, take complex technical challenges and delivering robust solutions. You'll keep digging until you can explain the fundamental physics or chemistry behind the failure mechanism.
  • You get a kick out of analyzing mounds of data and finding a pattern. You use data to drive decisions.
  • Work in a team to get results, are persistent and can keep others focused and aligned.

  Responsibilities:

  • Define electrical power delivery capabilities and reliability requirements for next generation package technologies based on customer use conditions.
  • Influence new package interconnect technology design, process and material capability decisions based on fundamental technical understanding of electro-migration mechanisms.
  • Design test vehicles to isolate failure mechanisms and the root causes.
  • Innovate analytical and experimental methods to validate package technology reliability.
  • Deliver analysis results and impact to multiple levels within the quality and reliability community and business partners.

  Candidate must exhibit the following behavioral traits/skills:

  • Organize, discipline and ability to manage tasks and time to ensure that business needs are met.
  • Technical and analytical problem solving.
  • Clarity in communication skills: able to make the complex simple and understood by a wide audience.
  • Leading and influencing cross-functional teams to achieve extraordinary results. Ability to advocate for new ideas.

  This is an entry level position and compensation will be given accordingly.

  Qualifications:

  You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences.

  Minimum Qualifications:

  • Masters degree in Materials Science, Electrical Engineering, Physics or Chemistry. Mechanical Engineering, Aerospace Engineering and Chemical Engineering with 1+ years of experience semiconductor packaging and thermal management.

  OR

  • PhD degree Materials Science, Electrical Engineering, Physics or Chemistry. Mechanical Engineering, Aerospace Engineering and Chemical Engineering with 6+ months of experience in semiconductor packaging and thermal management.

  AND

  • Must have the required degree or expect the required degree by June 2024.

  Preferred qualifications:

  • Semiconductor fabrication process, metal interconnects, packaging assembly and/or board system technology operations
  • Accelerated environmental testing, reliability testing and standards.
  • Empirical data collection and statistical data analysis, reliability statistics, and design of experiments.
  • Understanding the relationship between microstructure versus mechanical and physical properties of materials used in electronic packaging.
  • Working with fracture and adhesion mechanisms of materials and material interfaces
  • Imaging and analytical lab test equipment such as acoustic imaging, and x-ray imaging, SEM, EDX, TEM, FTIR, TMA, DMA, DSC, TGA, SIMS and mechanical testing machines.
  • Basic programming or scripting for data analysis. Experience with statistical software, MATLAB, Excel Macros.

  Job Type:

  College Grad

  Shift:

  Shift 1 (United States of America)

  Primary Location:

  US, Arizona, Phoenix

  Additional Locations:

  Business group:

  As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

  Posting Statement:

  All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

  Position of Trust

  N/A

  Work Model for this Role

  This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

• About the company

  Intel's innovation in cloud computing, data center, Internet of Things, and PC solutions is powering the smart and connected digital world we live in.

Notice