Job Details:

Job Description:

Microelectronic Packaging Media Engineers provide project management, design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

The responsibilities include, but are not limited to the following:

• Responsible for the thermal/mechanical/electrical design, analysis, and development of media.
• Defines overall package performance and specification and realizes technology certification through qualification plans and data collection.
• Conducts tests and research on basic materials and properties.
• Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
• Provides consultation concerning packaging problems and improvements in the packaging process.
• Responds to customer/client requests or events as they occur.
• Develops solutions to problems utilizing formal education and judgment.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Requirements:

• Possess a bachelor's degree in Mechanical Engineering or related STEM field.

Preferred Qualifications:

3+ years of experience with one or more of the following:

• Mechanical Design, CAD/Solidworks/Driveworks/RSS analysis/Geometric Dimensioning/Finite Eliminate Analysis.
• Material handling systems including high speed/accuracy pick-n-place, motion control and vision systems.
• Fundamental science and engineering concepts in development to create a novel design solutions for high volume manufacturing process.
• Stakeholder management (ex. supplier/ project management/internal partner management).
• Semiconductor devices and packaging processes and technology.
• Technical and analytical skills, with the knowledge of statistical design of experiments and problem-solving techniques.

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Business group:

Manufacturing and Product Engineering (MPE) is responsible for test development across product segments, supporting 95% of Intel's revenue. We deliver comprehensive pre-production test suites and component/physical debug capabilities to enable high quality, high volume manufacturing.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.