Job Details:

Job Description:

Wafer Assembly Technology Development - Packaging Engineers in Assembly Test and Technology Development will be responsible for, but are not limited to:

• Provide project management, development and sustaining support for Wafer Level Assembly processes and equipment in Epoxy/Mold/Advanced Wafer Prep bonding module to support Intel's next generation packaging technologies.
• Help developing innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies,
• Develop processes to meet quality reliability cost yield productivity and manufacturability requirements Innovate problem solve develop and continuously improve equipment and processes using experimental design and statistical methods.
• Process and equipment specification development applying principles for design of experiments and data analysis and planning and documentation of improvements through the white paper process
• Develop solutions to problems utilizing formal education statistical knowledge and problem solving tools.
• Train production and process engineers for technology transfer to other factories worldwide for High Volume Manufacturing.

A successful candidate should also exhibit the following behavioral traits:

• Technical leadership skills leadership strategic planning coaching and development of a technical team
• Lead teams in a highly matrix environment managing budgets resources and timelines
• Stakeholder management
• Flexibility in changing priorities and responsibilities to support business needs
• Tolerance for ambiguity in a fast-paced constantly changing product roadmap environment Influencing
• Self-initiated action oriented and work independently
• Technical innovation and deliver results for complex time critical technical projects

Demonstrated results and accountability for broad leadership, building of followership and role modeling of Intel's cultural attributes of:

• Customer obsessed - seek to understand what matters most to our customers, listening more and talking less.
• We work across boundaries, collaborating across the aisle and around the world.
• Fearless - We are bold. We take risks and challenge ourselves. We fail fast, iterate and continuously improve.
• Truth and Transparency - allows the best ideas to emerge and speeds our ability to solve problems faster.
• Inclusion - Inclusion runs through each attribute and is integral to our culture evolution
• Quality - Ensure a safe workplace and demonstrate discipline to deliver the products and services that our customers and partners can always rely on.

Qualifications:

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information .

You must possess the below requirements to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

• Possess a bachelor's degree with 3+ years of relevant experience or master's degree with 2+ years of relevant experience or PhD degree in Mechanical Engineering or Material Science Engineering or Chemical Engineering or Electrical Engineering or Physics or Chemistry or Optical Engineering or Polymer Science and Engineering or related field

Preferred Qualifications

6+ months of experience with one or more of the following:

• Fundamental science and engineering concepts in development to create novel solutions including Statistical Process Control (SPC)/Design of Experiments (DOE) principles
• TD project management. Programming experience in Python or MATLAB.
• Equipment automation development.
• Packaging the development of packaging processes and equipment.

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence.